Short delivery time thin plate laser processing
Supports thickness from 0.03mm! Distortion-free blank processing.
Nishino Seiki Manufacturing Co., Ltd. specializes in precision machining, and laser processing of thin plates is one of its strengths. One of the three laser processing machines owned is specifically designed for processing thin plates. **Features of Thin Plate Laser Processing** - Compatible plate thickness: 0.03 to 0.8 mm - High precision processing with ±0.03 accuracy - Minimum processing hole diameter: φ0.15 - Minimal thermal impact, resulting in a clean finish without distortion - Capable of laser processing high-reflectivity materials such as copper and pure aluminum Due to the ability to minimize distortion and achieve high precision, it can also handle the processing of thin products that require accuracy, such as terminals. There are numerous processing achievements for parts related to medical equipment, electronic components, and semiconductors. *For more details, please refer to the related links or feel free to contact us.*
- Company：西野精器製作所
- Price：Other
